Method of manufacturing a semiconductor integrated circuit device with elimination of static charge

ABSTRACT

A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.

This application is a Continuation application of application Ser. No.10/932,237, filed Sep. 2, 2004 now U.S. Pat. No. 7,172,981, which is aContinuation application of application Ser. No. 09/941,835, filed Aug.30, 2001 now abandoned, the contents of which are incorporated herein byreference in their entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a technique for manufacturing asemiconductor integrated circuit device. More specifically, the presentinvention relates to a technique effectively applied to a staticelimination technique of a semiconductor substrate and an accommodatingtechnique of a closed type.

For example, as methods of static-eliminating the substrate, techniquesthereof are disclosed in Japanese Patent Laid-open No. 8-8319, No.7-14761 and No. 9-223673.

First, according to a technique disclosed in Japanese Patent Laid-openNo. 8-8319, air is ionized by using an antistatic or static-eliminationmechanism such as an ionized air generator, and the ionized air is blownon a substrate, thereby antistatic or static-elimination of thesubstrate is carried out, so that trouble such as miss transportation ofsubstrates, or the like is prevented.

According to the technique disclosed in Japanese Patent Laid-open No.7-14761, under the state that non-reactive gas is filled in a case inwhich an electrically charged substrate is put, electric charges of theelectrically charged substrate are neutralized by generating ions andelectrons in the case, and thereby complete annihilation ofelectromagnetic noise free, contamination free and residual potentialcan be achieved.

According to the technique disclosed in Japanese Patent Laid-open No.9-223673, a transport apparatus is described which is capable oftransporting a semiconductor substrate into a reactor that grows apredetermined semiconductor layer, without bringing out thesemiconductor substrate outside the system thereof. Ion of predeterminedgas is generated in predetermined atmosphere and thereby a semiconductorsubstrate in the transport apparatus is static-eliminated.

With respect to a clean room for performing manufacturing processes orthe like of a semiconductor substrate, for example, the associatedtechnology is described in pp. 16-21 of “Electronic Materials, AugustIssue” published on 1 Aug., 2000 by Kogyo Chosakai Co., Ltd. This issuereports a clean room structure including mini-Environment (meaning smallenvironment made of a sealed container for isolating products fromcontamination and human being) and an elimination of chemicalcontaminant, etc.

SUMMARY OF THE INVENTION

Since, in processes for manufacturing a semiconductor, particularly, inpre-processes thereof, semiconductor substrates are transported betweenrespective processes, various semiconductor-accommodating containers(called, for example, carrier cassettes) have been used.

These semiconductor-accommodating containers are categorized into asealed type called FOUP (Front Opening Unified Pod) and an unsealed typecalled OC (Open Cassette). Both types accommodate a plurality ofsemiconductor substrates stacked such that space intervenestherebetween.

The FOUP comprises a container body having an opening for carrying in orout the semiconductor substrates, and a cover for closing this opening.The container body is sealed by closing the cover.

In the future, the above-mentioned mini-Environment concept using theFOUP will be requested when each semiconductor substrate having adiameter of 300 mm is used. However, currently, a unsealed type OC hasbeen also used.

Incidentally, inventors have found that the above-mentioned staticelimination technique has the following problems.

That is, on a production line using the OC, an ionizer used as a staticeliminator is installed above a load port in a semiconductormanufacturing apparatus. Accordingly, it is impossible tostatic-eliminate the semiconductor substrates after disposition thereof,by a semiconductor manufacturing apparatus, or an inspecting apparatus,or a transport robot handling section (hereafter referred to as a robothand) provided in a semiconductor manufacturing apparatus, or the like.

If each semiconductor substrate is charged by static or the like, therobot hand cannot grasp it because the charged semiconductor substrateis slippery. This causes a handling error, and thereby an error occurson the full-automatic line and the line is stopped.

Once the line stops, there occurs a problem of time-consumingmaintenance (recovery work) thereof and decrease in productiveefficiency.

And, if each semiconductor substrate is charged, a spark is generatedand a leakage current is created due to discharge when the robot handgrasps the semiconductor substrate. As a result, there arises a problemof occurrence of electric damage to the semiconductor substrate.

And, if a handling error of the robot hand causes a semiconductorsubstrate to move, there arises a problem of generation of particles.

Moreover, if the semiconductor substrate is charged, adhesion of foreignmaterials to the semiconductor substrate is increased and thereby therearises a problem of decrease of yield in the semiconductor substrate.

When the FOUP, which is a sealed semiconductor-accommodating containerfor the semiconductor substrates having a diameter of 300 mm, is used,the inventors found that the following problems are included in a SEMI(Semiconductor Equipment and Materials International) standard in whicha specification about the FOUP is incorporated.

That is, as shown in a comparative example of FIG. 12, the SEMIstandards E47.1 and E62 provide that if a length L of asemiconductor-accommodating container 200 is (y33), y33=165.5 mm±0.5 mmand that if a step D between a connected surface 120 a of an opener 120and a surface 150 a of a surface plate 150 has a tolerance of (y34),y34=±0.25 mm.

Accordingly, a cover 220 of the semiconductor-accommodating container200 may be retracted up to 1 mm from the front external periphery of acontainer body 210. The container length L of the entiresemiconductor-accommodating container 200 may be a minimum value of 165mm.

With respect to a distance for parallel moving thesemiconductor-accommodating container 200, the container length L isoften adjusted to be 165.5 mm for the container. In the case of thesemiconductor-accommodating container 200 which has a small containerlength L or in which the cover 220 is retracted, when the cover 220 isopened, the opener 120 can not close adhere to the cover 220 of thesemiconductor-accommodating container 200.

In this case, a rotary key 121 cannot be satisfactorily inserted intothe cover 220. Rotation of the rotary key 121 causes damage to a platelocated in the side of an exposure surface 220 a of the cover 220, andcan unsatisfactorily rotate a key groove 221 of side of the cover 220.As a result, there arises such a problem that the cover 220 is notopened.

Further, when the cover 220 is closed, the rotary key 121 is rotatedwith the cover 220 incompletely fit into the semiconductor-accommodatingcontainer 200, so that there arises such a problem that thesemiconductor-accommodating container 200 is closed.

An object of the present invention is to provide a method ofmanufacturing a semiconductor integrated circuit device for decreasingforeign materials that adhere to a semiconductor substrate and forimproving a yield.

Further, an object of the present invention is to provide a method ofmanufacturing a semiconductor integrated circuit device for decreasinghandling errors and for increasing an operating ratio of manufacturing asemiconductor manufacturing apparatus.

Additionally, an object of the present invention is to provide a methodof manufacturing a semiconductor integrated circuit device foreliminating a damage to a semiconductor substrate, which is caused bydischarge, and for improving a yield.

Further, an object of the present invention is to provide a method ofmanufacturing a semiconductor integrated circuit device for eliminatinga damage to a semiconductor-accommodating container and for extending anuseful period.

Further, an object of the present invention is to provide a method ofmanufacturing a semiconductor integrated circuit device for decreasingerrors in opening or closing a semiconductor-accommodating container andfor reducing inactive time on a semiconductor manufacturing apparatusand a productive line.

The above-mentioned and other objects and novel features of the presentinvention will be apparent from description of the present specificationand accompanied drawings.

Of inventions disclosed in the present application, representative oneswill be briefly described as follows.

Namely, the present invention is one that a sealed typesemiconductor-accommodating container accommodating a semiconductorsubstrate is set on a load port of a semiconductor manufacturingapparatus, and that the semiconductor substrate taken out of thissemiconductor-accommodating container is processed by a treatmentsection in a transport area between said load port and treatment area,and the semiconductor substrate processed by said treatment section isstatic-eliminated and is accommodated in saidsemiconductor-accommodating container positioned on the load port.

Further, the present invention comprises the steps of: linking aninternal space of a first sealed type semiconductor-accommodatingcontainer which accommodates and is filled with a plurality of wafersgrounded, to a local cleaning chamber of a first wafer treatmentapparatus with cleanliness kept; transporting at least of one of saidplurality of wafers accommodated in said firstsemiconductor-accommodating container under said linking state by meansof a transport mechanism provided in said local cleaning chamber, andthereby accommodating the at least one in a wafer treatment section ofsaid first wafer treatment apparatus; executing a first treatmentrelative to said wafer accommodated in said first wafer treatmentsection; transporting said processed wafer by said transport mechanismafter said step (c), and thereby accommodating said processed wafergrounded in said first semiconductor-accommodating container;static-eliminating said processed wafer after said step (c) and beforethe step (d), or during the step (d); and releasing the linking statebetween said first semiconductor-accommodating container and said localcleaning chamber after said step (d), and thereby returning said firstsemiconductor-accommodating container to a full state.

Further, the present invention is one that a semiconductor-accommodatingcontainer is located on a stage of a semiconductor-accommodatingcontainer opening/closing apparatus provided with an opener having aconnection surface projecting from the surface of a surface plate, andthe connection surface of said opener is closely brought into contactwith an exposed surface of a semiconductor-accommodating container ofsaid cover, and said cover is held by said opener, and said cover isopened or closed, and thereby said semiconductor substrate is carried inor out.

Further, the present invention comprises the steps of: locating asemiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects over 0.25 mm from a surfaceof said surface plate; closely bringing the connection surface of saidopener into contact with an exposed surface of said cover, and holdingsaid cover by said opener; vertically moving said cover relative to anopening surface of said semiconductor-accommodating container by saidopener, and opening said cover, and connecting an opening portion ofsaid semiconductor-accommodating container and an opening portion ofsaid surface plate of said semiconductor-accommodating containeropening/closing apparatus to each other; and carrying said semiconductorsubstrate into or from semiconductor-accommodating container, through anopening portion of said semiconductor-accommodating container and anopening portion of said semiconductor-accommodating containeropening/closing apparatus, between said semiconductor-accommodatingcontainer and a semiconductor manufacturing apparatus in which saidsemiconductor-accommodating container opening/closing apparatus islocated.

Other aspects included in the present invention will be described bystating items.

1. A method of manufacturing a semiconductor integrated circuit device,comprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects over 0.25 mm from a surfaceof said surface plate; closely bringing the connection surface of saidopener into contact with an exposed surface of said cover, and holdingsaid cover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and opening said cover by saidopener, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which said semiconductor-accommodating containeropening/closing apparatus is located;

(c) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafter processingsaid semiconductor substrate in said treatment section;

(d) moving the semiconductor substrate processed at said step (c), tothe transport area in the semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(e) moving and accommodating said semiconductor substratestatic-eliminated at said step (d) to and in thesemiconductor-accommodating container.

2. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects 0.25 to 10 mm from a surfaceof said surface plate; closely bringing the connection surface of saidopener into contact with an exposed surface of said cover, and holdingsaid cover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and opening said cover by saidopener, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which said semiconductor-accommodating containeropening/closing apparatus is located;

(c) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafter processingsaid semiconductor substrate in said treatment section;

(d) moving the semiconductor substrate processed at said step (c), tothe transport area in the semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(e) moving and accommodating said semiconductor substratestatic-eliminated at said step (d) to and in thesemiconductor-accommodating container.

3. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects 1 mm from a surface of saidsurface plate; closely bringing the connection surface of said openerinto contact with an exposed surface of said cover, and holding saidcover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and opening said cover by saidopener, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which said semiconductor-accommodating containeropening/closing apparatus is located;

(c) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafter processingsaid semiconductor substrate in said treatment section;

(d) moving the semiconductor substrate processed at said step (c), tothe transport area in the semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(e) moving and accommodating said semiconductor substratestatic-eliminated at said step (d) to and in thesemiconductor-accommodating container.

4. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects over 0.25 to 10 mm from asurface of said surface plate; closely bringing the connection surfaceof said opener into contact with an exposed surface of said cover, andholding said cover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and opening said cover by saidopener, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which said semiconductor-accommodating containeropening/closing apparatus is located;

(c) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and processing saidsemiconductor substrate in said treatment section;

(d) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafter processingsaid semiconductor substrate in said treatment section;

(e) moving said semiconductor substrate processed at said step (d) tothe transport area in said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(f) moving and accommodating said semiconductor substratestatic-eliminated at said step (e) to and in saidsemiconductor-accommodating container.

Further other aspects included in the present invention will bedescribed by stating items.

1. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a sealed type semiconductor-accommodating containeraccommodating a semiconductor substrate, on a stage of asemiconductor-accommodating container opening/closing apparatus;

(b) opening cover of said semiconductor-accommodating container by anopener of said semiconductor-accommodating container opening/closingapparatus, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which the semiconductor-accommodating containeropening/closing apparatus is set;

(c) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafter processingsaid semiconductor substrate in said treatment section;

(d) moving said semiconductor substrate processed at said step (c) intothe transport area of said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(e) moving and accommodating the semiconductor substratestatic-eliminated at said step (d) to and in saidsemiconductor-accommodating container.

2. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a stage of a semiconductor-accommodating container, asealed type semiconductor-accommodating container which accommodates asemiconductor substrate and in which a contact portion being in contactwith at least said semiconductor substrate is formed by conductivematerials;

(b) opening cover of said semiconductor-accommodating container by anopener of said semiconductor-accommodating container opening/closingapparatus, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which the semiconductor-accommodating containeropening/closing apparatus is set;

(c) moving said semiconductor substrate to a transport area in saidsemiconductor manufacturing apparatus, and static-eliminating saidsemiconductor substrate in said transport area;

(d) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafter processingsaid semiconductor substrate in said treatment section;

(e) moving said semiconductor substrate processed at said step (d) intosaid transport area of said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(f) moving and accommodating the semiconductor substratestatic-eliminated at said step (e) to and in saidsemiconductor-accommodating container.

3. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a stage of a semiconductor-accommodating container, asealed type semiconductor-accommodating container which accommodates asemiconductor substrate and in which a contact portion being in contactwith at least said semiconductor substrate is formed by conductivematerials;

(b) opening cover of said semiconductor-accommodating container by anopener of said semiconductor-accommodating container opening/closingapparatus, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which the semiconductor-accommodating containeropening/closing apparatus is set;

(c) static-eliminating, in said transport area, a robot hand which islocated in said transport area and is ungrounded, and transporting saidsemiconductor substrate in the treatment section of said semiconductormanufacturing apparatus by this ungrounded robot hand;

(d) processing said semiconductor substrate in said treatment section;

(e) moving said semiconductor substrate processed at said step (d) tosaid transport area in said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(f) moving and accommodating said semiconductor substratestatic-eliminated at said step (e) to and in saidsemiconductor-accommodating container.

4. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a stage of a semiconductor-accommodating container, asealed type semiconductor-accommodating container which accommodates asemiconductor substrate and in which a contact portion being in contactwith at least said semiconductor substrate is formed by conductivematerials;

(b) opening cover of said semiconductor-accommodating container by anopener of said semiconductor-accommodating container opening/closingapparatus, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which the semiconductor-accommodating containeropening/closing apparatus is set;

(c) moving said semiconductor substrate to a transport area in saidsemiconductor manufacturing apparatus, and thereafter processing saidsemiconductor substrate in said treatment section;

(d) moving the semiconductor substrate processed at said step (c) to aload lock chamber in said semiconductor manufacturing apparatus, andsupporting said semiconductor substrate by means of an substratesupporting stand ungrounded in this load lock chamber;

(e) moving said semiconductor substrate from said load lock chamber to atransport area of said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(f) moving and accommodating said semiconductor substratestatic-eliminated at said step (e) to and in saidsemiconductor-accommodating container.

5. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container accommodating asemiconductor substrate on a load port of a semiconductor manufacturingapparatus;

(b) taking out said semiconductor substrate from saidsemiconductor-accommodating container, and transporting saidsemiconductor substrate to a treatment section of said semiconductormanufacturing apparatus;

(c) process-treating said semiconductor substrate in said treatmentsection;

(d) moving the semiconductor substrate processed at said step (c) to atransport area between said treatment section and said load port in saidsemiconductor manufacturing apparatus, and static-eliminating saidsemiconductor substrate in said transport area; and

(e) accommodating the semiconductor substrate static-eliminated at saidstep (d), in said semiconductor-accommodating container located on saidload port of said semiconductor manufacturing apparatus.

6. A method of manufacturing a semiconductor integrated circuit device,comprises the steps of:

(a) locating, on a load port of a semiconductor manufacturing apparatus,a semiconductor-accommodating container which accommodates asemiconductor substrate and in which a contact portion being in contactwith at least said semiconductor substrate is formed by conductivematerials and which is grounded;

(b) taking said semiconductor substrate from saidsemiconductor-accommodating container and moving said semiconductorsubstrate to a transport area of said semiconductor manufacturingapparatus having a treatment section and said transport area;

(c) static-eliminating said semiconductor substrate in said transportarea by an ionizer;

(d) moving said semiconductor substrate to said treatment section andprocess-treating said semiconductor substrate in said treatment section;

(e) moving the semiconductor substrate processed at said step (d) tosaid transport area and static-eliminating said semiconductor substratein said transport area by said ionizer; and

(f) accommodating the semiconductor substrate static-eliminated at saidstep (e), in said semiconductor-accommodating container located on saidload port.

7. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a load port of a semiconductor manufacturing apparatus,a semiconductor-accommodating container which accommodates asemiconductor substrate and in which a contact portion being in contactwith at least said semiconductor substrate is formed by conductivematerials and which is grounded;

(b) taking said semiconductor substrate from saidsemiconductor-accommodating container and moving said semiconductorsubstrate to a transport area of said semiconductor manufacturingapparatus having a treatment section and said transport area;

(c) supporting said semiconductor substrate by a robot handstatic-eliminated in said transport area, and static-eliminating saidsemiconductor substrate in said transport area;

(d) moving said semiconductor substrate to said treatment section bysaid robot hand, and processing said semiconductor substrate in saidtreatment section;

(e) moving, to said transport area, said semiconductor substrateprocessed at said step (d), and supporting said semiconductor substrateby said robot hand in said transport area, and static-eliminating saidthe semiconductor substrate; and

(f) accommodating said semiconductor substrate static-eliminated at saidstep (e), in said semiconductor-accommodating container located on saidload port.

8. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a load port of a semiconductor manufacturing apparatus,a semiconductor-accommodating container which accommodates asemiconductor substrate and in which a contact portion being in contactwith at least said semiconductor substrate is formed by conductivematerials;

(b) opening a cover of said semiconductor-accommodating container by anopener of a semiconductor-accommodating container opening/closingapparatus provided in said semiconductor manufacturing apparatus, andtaking out said semiconductor substrate, and transporting saidsemiconductor substrate into said semiconductor manufacturing apparatus;

(c) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafterprocess-treating said semiconductor substrate in said treatment section;

(d) moving said semiconductor substrate processed at said step (c) to atransport area in said semiconductor manufacturing apparatus betweensaid treatment section and said load port, and static-eliminating saidsemiconductor substrate in said transport area; and

(e) moving and accommodating said semiconductor substratestatic-eliminated at said step (d) to and in saidsemiconductor-accommodating container.

9. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 8, wherein cleanliness of said transport area ishigher than that of a periphery of said load port.

10. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a stage of a semiconductor-accommodating containeropening/closing apparatus, a semiconductor-accommodating container whichaccommodates a semiconductor substrate and whose the entire is formed ofconductive materials;

(b) opening a cover of said semiconductor-accommodating container by aopener of said semiconductor-accommodating container opening/closingapparatus, and taking out semiconductor substrate, and transporting saidsemiconductor substrate into semiconductor manufacturing apparatus inwhich said semiconductor-accommodating container opening/closingapparatus is provided;

(c) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafterprocess-treating said semiconductor substrate in said treatment section;

(d) moving said semiconductor substrate processed at said step (c), to atransport area in said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(e) moving and accommodating said semiconductor substratestatic-eliminated at said step (d) to and in saidsemiconductor-accommodating container.

11. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a stage of a semiconductor-accommodating containeropening/closing apparatus, a semiconductor-accommodating container whichaccommodates a semiconductor substrate and whose the entire is formed ofconductive materials;

(b) opening a cover of said semiconductor-accommodating container by aopener of said semiconductor-accommodating container opening/closingapparatus, and taking out semiconductor substrate, and transporting saidsemiconductor substrate into semiconductor manufacturing apparatus inwhich said semiconductor-accommodating container opening/closingapparatus is provided;

(c) moving said semiconductor substrate to a transport area in saidsemiconductor manufacturing apparatus and static-eliminating saidsemiconductor substrate in said transport area;

(d) transporting said semiconductor substrate to a treatment section ofsaid semiconductor manufacturing apparatus, and thereafterprocess-treating said semiconductor substrate in said treatment section;

(e) moving the semiconductor substrate processed at said step (d), to atransport area in said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area;and

(f) moving and accommodating said semiconductor substratestatic-eliminated at said step (e) to and in saidsemiconductor-accommodating container.

12. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating, on a stage of a semiconductor-accommodating container, asemiconductor-accommodating container which accommodates a semiconductorsubstrate and in which a contact portion being in contact with at leastsaid semiconductor substrate is formed by conductive materials;

(b) opening cover of said semiconductor-accommodating container by anopener of said semiconductor-accommodating container opening/closingapparatus, and taking out said semiconductor substrate, and transportingsaid semiconductor substrate into a semiconductor manufacturingapparatus in which the semiconductor-accommodating containeropening/closing apparatus is set;

(c) moving said semiconductor substrate to a transport area in saidsemiconductor manufacturing apparatus, and thereafter process-treatingsaid semiconductor substrate in said treatment section;

(d) moving the semiconductor substrate processed at said step (c), to atransport area in said semiconductor manufacturing apparatus, andstatic-eliminating said semiconductor substrate in said transport area,and preventing said semiconductor substrate from being contaminated inchemical, by a chemical filter provided in said transport area; and

(e) moving and accommodating said semiconductor substratestatic-eliminated at said step (d) to and in saidsemiconductor-accommodating container.

13. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 12, further comprises a step of preventing saidsemiconductor substrate from being contaminated in chemical, by saidchemical filter in said transport area, before and after process of saidsemiconductor substrate in said treatment section.

14. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 1, further comprises a step of single-wafer-processingsaid semiconductor substrate in said treatment section of saidsemiconductor manufacturing apparatus.

15. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 14, wherein, during a single wafer process of saidsemiconductor substrate in said treatment section of said semiconductormanufacturing apparatus, a semiconductor substrate to be next-processedwaits in a load lock chamber of said semiconductor manufacturingapparatus.

16. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 1, further comprises a step of moving vertically saidcover relative to an opening surface of said semiconductor-accommodatingcontainer by said opener of said semiconductor-accommodating containeropening/closing apparatus, and opening said cover, and carrying in orout said semiconductor substrate while said semiconductor substrate iscarried in or out into said semiconductor-accommodating container.

17. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 1, wherein a substrate having a diameter of 300 mm isused as said semiconductor substrate.

18. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects over 0.25 mm from a surfaceof said surface plate; closely bringing the connection surface of saidopener into contact with an exposed surface of said cover, and holdingsaid cover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and holding said cover by saidopener;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided.

19. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects over 0.3 mm from a surface ofsaid surface plate; closely bringing the connection surface of saidopener into contact with an exposed surface of said cover, and holdingsaid cover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and holding said cover by saidopener;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided.

20. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects over 0.7 mm from a surface ofsaid surface plate; closely bringing the connection surface of saidopener into contact with an exposed surface of said cover, and holdingsaid cover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and holding said cover by saidopener;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided.

21. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects at 1.0 mm from a surface ofsaid surface plate; closely bringing the connection surface of saidopener into contact with an exposed surface of said cover, and holdingsaid cover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and holding said cover by saidopener;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided.

22. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that an overlapamount between a distance between a surface of said surface plate andthe connection surface of said opener, and a distance between a facialreference surface and an exposed surface of said cover of saidsemiconductor-accommodating container is set to be more than zero;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and holding said cover by saidopener;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided, wherein

said overlap amount of each of all semiconductor-accommodatingcontainers moving on a semiconductor manufacturing line is more thanzero.

23. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that an overlapamount between a distance between a surface of said surface plate andthe connection surface of said opener, and a distance between a facialreference surface and an exposed surface of said cover of saidsemiconductor-accommodating container is set to be more than zero and1.25 mm or less;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and holding said cover by saidopener;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided, wherein

said overlap amount of each of all semiconductor-accommodatingcontainers moving on a semiconductor manufacturing line is more thanzero and 1.25 mm or less.

24. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed;

(b) holding said cover by said opener;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided, wherein

a rate of no close contact portion between the connection surface ofsaid opener and the exposed surface of said cover is 1% or less out ofall semiconductor-accommodating containers moving on a semiconductormanufacturing line when said opener holds said cover in said step (b).

25. A method of manufacturing a semiconductor integrated circuit devicecomprises the steps of:

(a) locating a semiconductor-accommodating container on a stage of asemiconductor-accommodating container opening/closing apparatus, whereinsaid semiconductor-accommodating container opening/closing apparatuscomprises said stage capable of locating saidsemiconductor-accommodating container accommodating a semiconductorsubstrate, an opener for opening or closing a cover of saidsemiconductor-accommodating container, and a surface plate in which anopening portion for locating said opener is formed, such that aconnection surface of said opener projects from a surface of saidsurface plate; closely bringing the connection surface of said openerinto contact with an exposed surface of said cover, and holding saidcover by said opener;

(b) closely bringing the connection surface of said opener into contactwith the exposed surface of said cover, and holding said cover by saidopener, with said opener retreated by said cover;

(c) moving vertically said cover relative an opening surface of saidsemiconductor-accommodating container by said opener, and opening saidcover, and connecting an opening portion and the opening portion of saidsurface plate of said semiconductor-accommodating containeropening/closing apparatus; and

(d) carrying in or out said semiconductor substrate to or from saidsemiconductor-accommodating container via the opening of saidsemiconductor-accommodating container and the opening of saidsemiconductor-accommodating container opening/closing apparatus betweensaid semiconductor-accommodating container and a semiconductormanufacturing apparatus in which said semiconductor-accommodatingcontainer is provided.

26. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 18, further comprises a step of closely bringing theconnection surface of said opener into contact with the exposed surfaceof said cover, and retreating said cover by said opener when said openerholds said cover of said semiconductor-accommodating container.

27. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 18, further comprises a step ofsingle-wafer-processing said semiconductor substrate in a treatmentsection of said semiconductor manufacturing apparatus.

28. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 27, wherein, during a single wafer process of saidsemiconductor substrate in said treatment section of said semiconductormanufacturing apparatus, a semiconductor substrate to be next-processedwaits in a load lock chamber of said semiconductor manufacturingapparatus.

29. A method of manufacturing a semiconductor integrated circuit deviceaccording to item 18, wherein a substrate having a diameter of 300 mm isused as said semiconductor substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and B are external perspective views showing a structuralexample of a semiconductor-accommodating container opening/closingapparatus used for the method of manufacturing a semiconductorintegrated circuit device according to embodiment 1 of the presentinvention, wherein FIG. 1A shows a front structure and FIG. 1Billustrates a rear structure.

FIG. 2 is a perspective view-showing a structural example of asemiconductor-accommodating container (FOUP) used for the method ofmanufacturing a semiconductor integrated circuit device according toembodiment 1 of the present invention.

FIG. 3 is a partial perspective view showing a structural example of asemiconductor manufacturing apparatus equipped with thesemiconductor-accommodating container opening/closing apparatuses shownin FIG. 1.

FIG. 4 is a side view showing an internal structure of the semiconductormanufacturing apparatus as shown in FIG. 3.

FIG. 5 is a plan view showing an internal structure of the semiconductormanufacturing apparatus as shown in FIG. 3.

FIG. 6 is a flowchart exemplifying a transport sequence forsemiconductor substrates in the method of manufacturing a semiconductorintegrated circuit device according to embodiment 1 of the presentinvention.

FIG. 7 is a side view showing an internal structure of a semiconductormanufacturing apparatus as a modification to the semiconductormanufacturing apparatus as shown in FIG. 4.

FIG. 8 is a partial side view showing an elevator operation of thesemiconductor-accommodating container opening/closing apparatus usingthe semiconductor-accommodating container as a modification to thesemiconductor-accommodating container shown in FIG. 2.

FIG. 9 is a partial plan view showing an example of a step between anopener's connection surface and a surface plate's surface used for themethod of manufacturing a semiconductor integrated circuit deviceaccording to embodiment 2 of the present invention.

FIG. 10 is a partial plan view showing an example of an overlap amountbetween an opener's connection surface and a semiconductor-accommodatingcontainer's exposed surface in the semiconductor-accommodating containeropening/closing apparatus according to embodiment 2 of the presentinvention.

FIG. 11 is a partial side view showing an example of holding the openerof the semiconductor manufacturing apparatus in FIG. 10.

FIG. 12 is a partial plan view showing relationship between thesemiconductor-accommodating container opening/closing apparatus and thesemiconductor-accommodating container in the comparative example forembodiment 2.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

1. A semiconductor substrate or a semiconductor wafer means a siliconsingle-crystal substrate, an SOI (Silicon On Insulator) substrate(generally disk-shaped), a sapphire substrate, a glass substrate, otherinsulating or semi-insulating or semiconductor substrates or the like,or a composite substrate thereof. A semiconductor integrated circuitdevice described in the present application also means a semiconductorsuch as a silicon wafer, a sapphire substrate or the like; somethingformed on an insulating substrate; or something formed on otherinsulating substrates made from glasses or the like such as TFT (ThinFilm Transistor) and STN (Super Twisted Nematic) liquid crystals and thelike, particularly except for the cases specified.

2. Semiconductor-accommodating container: This means a container foraccommodating a plurality of semiconductor substrates. In this, a FOUPmeans a sealed type container comprising a cover and a container body.

3. Facial reference surface: This means to divide the semiconductorsubstrate into two parts and means a vertical surface parallel to afront side (which the semiconductor substrate is removed from orinserted into) of the semiconductor-accommodating container.

4. Semiconductor-accommodating container opening/closing apparatus: Thismeans an apparatus for opening and closing a cover of awafer-accommodating container such as FOUP, and, for example, comprisesa metal plate or the like called an opener.

5. Treatment section: For example, a wafer treatment section means anapparatus portion for accommodating wafers therein and performingpredetermined treatment similarly to a plasma reaction chamber in a dryetching apparatus, and generally does not include a transport section ora wait section for only carrying the wafers thereto.

6. Transport area: This means a section of mainly carrying in or outwafers between a semiconductor-accommodating container such as FOUP andthe wafer treatment section, and, for example, means a region or thelike between a load port and the wafer treatment section. Accordingly,in the case where there is provided an auxiliary treatment section forpre-alignment, etc., such the section is generally included in thetransport area, too.

7. Ionizer: This means an apparatus for generating positive and negativeions by ionizing ambient atmosphere gas. In semiconductor industries,the ionizer is often used for static-eliminating wafers generally byneutralizing predetermined portions. Concretely, the ionizer means anapparatus for generating a corona discharge by applying high voltage toa needle-shaped or narrow line-shaped electrode, and for ionizingpositively or negatively ambient air, and for neutralizing electriccharges on the surface of an electrically charged object by using areversed-polarity ion.

8. Fan filter unit: This means an air cleaner integrating a small airblower into a ULPA (Ultra Low Penetration Air) filter. The ULPA filteris air filter having a particle collecting ratio of 99.9995% or morerelative to a particle having a diameter of 0.15 μm at a rated air flow.

9. Chemical filter: This means a filter having a purpose of removinggaseous pollutant in air

Embodiments of the present invention will be described in detail withreference to the drawings.

If advantageously necessary, the following embodiments are described bydividing into a plurality of sections or sub-embodiments. However,except for particularly specified cases, these divided sections orsub-embodiments do not have anything to do with each other but one ofthese has something to do with one portion or the entire of the othersin modifications, or detailed or supplemented explanation, or the like.

Except for the cases where the number or the like of elements (includingthe number of article, numeric values, amounts, ranges or the like), andfor the case specified particularly, and for the case of principled andobvious restriction of the specific number, and the like, the followingembodiments are limited to the specific number and may include thenumber more or less than or equal to the specific number.

Furthermore, in the following embodiments, needless to say, componentsthereof (including elemental steps or the like) are not always essentialthereto, except for the cases specified particularly, and for the casethought of as in principle and obviously essential, and the like.

Likewise, in the following embodiments, reference to shapes, positionalrelationship or the like of the components or the like includes onessubstantially similar or closely akin to the shapes or the like, exceptfor the cases specified particularly, for the case thought of as inprinciple and obviously essential, and the like. This also applies tothe above-mentioned numeric values and ranges.

Though all the Figures for explaining the embodiments, members havingthe same functions are denoted by the same reference numerals andrepetitive description thereof will be omitted.

Embodiment 1

FIGS. 1A and 1B are external perspective views showing a structuralexample of a semiconductor-accommodating container opening/closingapparatus used for a method of manufacturing a semiconductor integratedcircuit device that is embodiment 1 of the present invention. FIG. 1Ashows a front side of the structure. FIG. 1B shows a rear side of thestructure. FIG. 2 is a perspective view showing a structural example ofa semiconductor-accommodating container (FOUP) used for the method ofmanufacturing a semiconductor integrated circuit device that isembodiment 1 of the present invention. FIG. 3 is a partial perspectiveview showing a structural example of a semiconductor manufacturingapparatus in which the semiconductor-accommodating containeropening/closing apparatus shown in FIG. 1 is installed. FIG. 4 is a sideview showing an internal structure of the semiconductor manufacturingapparatus shown in FIG. 3. FIG. 5 is a plan view showing an internalstructure of the semiconductor manufacturing apparatus shown in FIG. 3.FIG. 6 is a sequential flowchart showing an example of a transportsequence for semiconductor substrates in the method of manufacturing asemiconductor integrated circuit device that is embodiment 1 of thepresent invention. FIG. 7 is a side view showing an internal structureof a modification of the semiconductor manufacturing apparatus shown inFIG. 4. FIG. 8 is a partial side view showing an operation of anelevator in the semiconductor-accommodating container opening/closingapparatus using a modification of the semiconductor-accommodatingcontainer shown in FIG. 2.

In the method of manufacturing a semiconductor integrated circuit devicethat is the present embodiment 1, a semiconductor-accommodatingcontainer 200 (hereafter referred to as a container 200) of a sealedtype is used, and a semiconductor substrate (a semiconductor wafer) 300accommodated therein is taken out and transported into a semiconductormanufacturing apparatus 400, and desired process treatment (for example,treatment performed in pre-treatment such as exposure, etching,sputtering, film-formation, or the like) is performed by thissemiconductor manufacturing apparatus 400, and thereafter thesemiconductor substrate 300 finishing the treatment thereof isaccommodated in the container 200 again.

The semiconductor substrate 300 composed of a large-sized member havinga diameter of 300 mm. Here, as the container 200 for accommodating this,a front-opening/closing type FOUP will be described.

With reference to FIGS. 1A and 1B and 2 to 5, a structure of thesemiconductor manufacturing apparatus 400 is described, whichcorresponds to a mini-Environment (meaning small environment made of asealed container for isolating products from contamination and humanbeing) used by the method of the manufacturing the semiconductorintegrated circuit device that is the present embodiment 1.

As shown in FIGS. 3, 4, and 5, the semiconductor manufacturing apparatus400 mainly comprises a semiconductor-accommodating containeropening/closing apparatus 100 (hereafter referred to as anopening/closing apparatus 100), a treatment section 420 for performingdesired processes on the semiconductor substrate 300, and a transportarea 410 for carrying out the semiconductor substrate 300 between a loadport 100 a of the semiconductor manufacturing apparatus 400 and thetreatment section 420.

Further, as shown in FIGS. 1A, 1B and 2, the opening/closing apparatus100 comprises, if roughly divided, a stage 110 for mounting thecontainer 200 and an opener 120 for holding and opening/closing a cover220 of the container 200. As shown in FIG. 1A, the stage 110 is providedwith positioning pins 112 for accurately mounting the container 200 anda slider 111 for making the container 200 close to the opener 120.

According to this embodiment 1, the slider 111 is movable in afront-and-rear direction by means of a motor and a ball screw (notshown) provided in the stage 110. The opener 120 is provided with rotarykeys 121 which can be rotated through 90° by a motor (not shown)provided inside the opener 120.

As shown in FIG. 1B, the rear side of the opener 120 is provided with anopener opening/closing mechanism 130 and an opener rising/fallingmechanism 131. The opener opening/closing mechanism 130 opens and closesthe cover 220 of the container by going forward and backward the opener120 in a horizontal direction. The opener rising/falling mechanism 131makes the opener 120 rise and fall. The opener opening/closing mechanism130 and the opener rising/falling mechanism 131 are both operated by amotor and a ball screw (not shown). The entire driving sections of theopener opening/closing mechanism 130 and the opener rising/fallingmechanism 131 are provided with a safety cover 140 such that operatorsdo not easily come in contact therewith.

As shown in FIG. 4, the semiconductor manufacturing apparatus 400 isdivided into a transport area 410 and a treatment section 420 therein.FIG. 3 shows an example of the case where a structure that fouropening/closing apparatuses 100 are installed to the semiconductormanufacturing apparatus 400.

The transport area 410 is provided with a fan filter unit 412 on aninner ceiling thereof, and clean air flows from the top thereof to thebottom in a down-flow manner. During operation of the fan filter unit412, the transport area 410 is kept at cleanliness ISO1 to ISO2, andthereby can maintain a highly clean state in comparison to cleanlinessISO6 outside the semiconductor manufacturing apparatus 400.

If the semiconductor substrate 300 is left putting in the environment ofcleanliness ISO6, foreign materials adhere to the substrate surface astime goes, and thereby a yield of semiconductor parts (semiconductorintegrated circuits) formed on the semiconductor substrate 300 isremarkably decreased. The inside of the container 200 is shut out fromthe outside world. If the semiconductor substrate 300 is carried in orout in the highly clean environment, the cleanliness in the container ismaintained. So, even if the container 200 is left putting in theenvironment of cleanliness ISO6, a very small amount of foreignmaterials adheres to the semiconductor substrate 300 inside thecontainer 200 unless the cover 220 of the container 200 is opened andclosed.

FIGS. 4 and 5 schematically show an internal structure of thesemiconductor manufacturing apparatus 400 that is the presentembodiment 1. The transport area 410 is provided with the fan filterunit 412 on the internal ceiling, a transport robot 411, and analignment section 415 shown in FIG. 5. The transport robot 411 transfersthe semiconductor substrates 300 between the container 200 on the loadport 100 a and a load lock chamber 421 in the treatment section 420. Thealignment section 415 adjusts the position (direction) of thesemiconductor substrate 300 when the semiconductor substrate 300 istransferred to the load lock chamber 421.

Further, an ionizer 413 as a static eliminator is provided at the bottomof the fan filter unit 412 in the transport area 410. The ionizer 413static-eliminates the semiconductor substrate 300 which is intransportation or wait in the transport area 410, and static-eliminatesthe semiconductor substrate 300 in the container 200 put in the loadport 100 a.

That is, the semiconductor substrate 300 is static-eliminated when beingcarried in the load lock chamber 421 of the treatment section 420, orwhen being returned to the container 200 after processes are performedin the treatment section 420, or during waiting in the load lock chamber421, an unload lock chamber 422 or the alignment section 415, or when isaccommodated in the container 200 on the load port 100 a. The ionizerapplies ionized gas to the semiconductor substrate 300 and properlymaintains electric potential of the semiconductor substrate 300.

This can static-eliminate the semiconductor substrate 300 which isbefore-process and after-process in transportation within the transportarea 410, or which is in waiting at the load lock chamber 421, theunload lock chamber 422 and the alignment section 415, or which isaccommodated in the container 200, and can properly keep potential ofthe semiconductor substrate 300.

The treatment section 420 is provided with a treatment chamber 423 forperforming process at the semiconductor substrate 300. Between thetreatment chamber 423 and the transport area 410, there are provided theload lock chamber 421 and the unload lock chamber 422 which can besealed by gate valves 421 a and 422 a.

The load lock chamber 421 is provided with substrate supporting stands421 b in FIG. 4, by which the semiconductor substrate 300 is made towait and can be supported. The unload lock chamber 422 is also providedwith not shown members similar to the substrate supporting stands 421 b.

Nonconductive resin coating is applied to such contact portions that arobot hand 411 a of the transport robot 411 installed in the transportarea 410 is in contact with the semiconductor substrate 300.Nonconductive resin coating is also applied to such contact portionsthat the substrate supporting stands 421 b are in contact with thesemiconductor substrate 300.

Therefore, while the robot hand 411 a or each substrate supporting stand421 b is supporting the semiconductor substrate 300, its potential doesnot become 0 V.

Consequently, it is very effective to static-eliminate the semiconductorsubstrate 300 by providing the transport area 410 with the ionizer 413.

The following describes the structure of the container 200 used for themethod of manufacturing the semiconductor integrated circuit device thatis the present embodiment 1.

The container 200 shown in FIG. 2 is a sealed type and comprises acontainer body 210 (container section) and the cover 220 (containercover section). The container body 210 has four latch grooves 211 and aflange 212 provided around an opening 210 a of the container body 210.

The container body 210 has an opening portion 210 a formed by opening afirst face at a front surface side thereof. The container body 210includes a substrate holding section 210 b which functions as a shelffor horizontally accommodating the semiconductor substrate 300. Forexample, the container body 210 can accommodate twenty-fivesemiconductor substrates 300.

On the other hand, the cover 220 maintains a sealed state by coming inclose contact with the container body 210 at a peripheral portion of theabove-mentioned first surface.

The cover 220 has key grooves 221 (keyhole portion) at positionscorresponding to the rotary keys 121 of the opening/closing apparatus100. When the rotary keys 121 of the opening/closing apparatus 100 areinserted into the key grooves 221 and are rotated up to an angle of 90°,four latches 222 provided with the cover 220 project or withdraw fromthe cover 220 by means of a cam mechanism (not shown) in the cover 220.At this time, the latches 222 are positioned to correspond to the latchgrooves 211 of the container body 210. With the cover 220 inserted intothe container body 210, if the latches 222 is made to project from theperiphery of the cover 220, the cover 220 can be fixed to the containerbody 210.

The container 200 has a double structure comprising an external shellportion and an inside portion. That is, the inside portion is providedwith substrate holding sections 210 b being in contact with thesemiconductor substrate 300, and is made by conductive materials so thatthe semiconductor substrate 300 is set to have a potential of 0 V. Theabove-mentioned external shell is made by nonconductive materials.

The container 200 is not necessarily limited to the double structure,and may be a single structure that is integrally made by conductivematerials as a whole. Although contact portions coming in contact withat least the semiconductor substrate 300 are preferably formed byconductive materials, the entire thereof may be formed by nonconductivematerials.

Moreover, the conductive materials are, for example, resin materialscontaining carbon particles or the like, and polycarbonate or the likeis used as the above-mentioned resin materials.

When the conductive materials are used, surface resistivity R (Ω) of thecontainer 200 has an optimum range of 1×10⁶≦R≦1×10⁹, an appropriaterange of 1×10⁵≦R≦1×10¹³, and an allowable range of 1×10⁴≦R≦1×10¹⁴.

In the container 200, these conductive materials are portions being incontact with the semiconductor substrate 300 which is a wafer. However,the entire container 200 may be formed by these conductive materials.

Next, opening and closing operations of the container 200 will bedescribed, which is used in the method of manufacturing thesemiconductor integrated circuit device that is the present embodiment1.

First, described is an operation for opening the sealed type container200. The container 200 (first semiconductor-accommodating container) isplaced on the stage 110. The slider 111 on the stage 110 is then movedin parallel at a side of the semiconductor manufacturing apparatus 400.Each rotary key 121 (key section) on a connection surface 120 a of theopener 120 for the opening/closing apparatus 100 is inserted into eachkey groove 221 (keyhole section) in an exposed surface 220 a of thecover 220 for the container 200.

With this state, by rotating each rotary key 121 at 90° clockwiserelative to the container 200, each key groove 221 in the cover 220rotates and the cover 220 is fitted to the opener 120. At the same time,by cam mechanism (not shown) inside the cover 220, each latch 222 isaccommodated inside the cover 220.

Then, by horizontally moving the opener opening/closing mechanism 130 ina side of the semiconductor manufacturing apparatus 400, the cover 220of the container 200 is detached from the container body 210. Then, bythe opener rising/falling mechanism 131 the opener 120 is made to fall.

On the other hand, an operation for closing the container 200 isexecuted, contrary to the above-mentioned opening operation, by makingthe opener rising/falling mechanism 131 rise and by horizontally movingopener opening/closing mechanism 130 in a side of the stage 110, thecover 220 fitted to the opener 120 is connected to the container body210.

Thereafter, by rotating each rotary key 121 at 90° counterclockwise,each latch 222 of the cover 220 is accommodated in each latch groove 211and the cover 220 is fitted into the container body 210

Finally, the slider 111 is moved in parallel at an opposite side of thesemiconductor manufacturing apparatus 400 and a state is formed in whichthe container 200 is detached from the stage 110.

Next, by using FIGS. 1 to 6, a sequence for carrying in or out thesemiconductor substrate 300 to/from the semiconductor manufacturingapparatus 400 in the method of manufacturing the semiconductorintegrated circuit device that is the present embodiment 1 will bedescribed in accordance with a sequence flowchart shown in FIG. 6.

First, as shown at step S1 in FIG. 6, the first sealed type container200 accommodating a plurality of semiconductor substrates 300(semiconductor substrates 300 of (A) shown by FIG. 5) is set on the loadport 100 a of the semiconductor manufacturing apparatus 400.

Since contact portions being in contact with the semiconductor substrate300 such as at least the substrate holding section 210 b or the like inthe container 200 are made by conductive materials, the semiconductorsubstrate 300 accommodated in the container 200 is grounded to theopening/closing apparatus 100 via the container 200. Therefore, thesemiconductor substrate 300 in the container 200 on the load port 100 ahas a potential of almost 0 V.

Namely, a plurality of semiconductor substrates 300 is accommodated inthe sealed type container 200 with the semiconductor substrates 300grounded.

Then, the cover 220 of the container 200 is opened by the opener 120 ofthe opener rising/falling mechanism 131 for the opening/closingapparatus 100 installed on the semiconductor manufacturing apparatus400.

Here, a local cleaning chamber 430 having the transport area 410 has asurface 150 a (front surface portion) of a surface plate 150 for theopening/closing apparatus 100. The surface 150 a comes in contact withor closely faces the first face of the first sealed type container 200.There is formed an opening portion 150 b (connection opening portion) inthis surface 150 a.

The opener 120 is provided so as to cover the opening 150 a and has therotary keys 121 (key section) which connect to the key grooves 221 undera projected state.

With each rotary key 121 (key section) of the opener 120 inserted intoeach key groove 221 (keyhole section) of the cover 220 in the FOUP, anunlocking operation is executed. Thereafter, with the cover 220 held bythe opener, the opener 120 is introduced into the local cleaning chamber430.

By keeping the cleanliness, the internal space of the container 200 islinked to the local cleaning chamber 430 provided with the transportarea 410 for the semiconductor manufacturing apparatus 400 (first wafertreatment apparatus).

Thereafter, under a linking state described above, the transport robot411 carries the semiconductor substrate 300 accommodated in thecontainer 200. The transport robot 411 is a transport mechanism providedin the transport area 410 of the local cleaning chamber 430.

The robot hand 411 a (contact section) of the transport robot 411installed in the transport area 410 holds (seizes) the semiconductorsubstrate 300 and take it out from the container 200. After thesemiconductor substrate 300 is introduced in the transport area 410, thetransport robot 411 moves the semiconductor substrate 300 (semiconductorsubstrate 300 of (B) shown in FIG. 5) to the alignment section 415 (StepS2).

Since the container 200 in this embodiment is a front opening/closingtype FOUP, the cover 220 is vertically moved relative to an openingsurface of the container 200 by the opener 120 and thereby is opened.

Moreover, since nonconductive resin coating is applied to contactportions between the robot hand 411 a of the transport robot 411 and thesemiconductor substrate 300, the semiconductor substrate 300 isungrounded while being held by the robot hand 411 a. Namely, thesemiconductor substrate 300 does not have a potential of 0 V while beingtransported by the transport robot 411.

However, in the semiconductor manufacturing apparatus 400 that is thepresent embodiment 1, since the ionizer 413 is provided in the transportarea 410, static elimination of the ionizer 413 can prevent thesemiconductor substrate 300 in the transport area 410 from being chargedand the robot hand 411 a of the transport robot 411 too can bestatic-eliminated.

Thereafter, alignment (adjustment of direction and position) of thesemiconductor substrate 300 is executed by the alignment section 415.Static elimination can be executed by the ionizer 413 since thealignment section 415 is also linked to the transport area 410.

After the alignment, the transport robot 411 takes the semiconductorsubstrate 300 from the alignment section 415. The transport robot 411transports the semiconductor substrate 300 to the load lock chamber 421(Step S3). The substrate supporting stands 421 b of the load lockchamber 421 as shown in FIG. 4 support the semiconductor substrate 300(semiconductor substrate 300 of (C) shown in FIG. 5).

Since nonconductive resin coating is applied to contact portions betweenthe semiconductor substrate 300 and the substrate supporting stands 421b, the semiconductor substrate 300 does not have a potential of 0 V inthe load lock chamber 421, similarly to the case where it is transportedby the above-mentioned transport robot 411. However, static eliminationis executed by the ionizer 413 because the load lock chamber 421 is alsolinked to the transport area 410. At this time, it is also possible tostatic-eliminate the substrate supporting stands 421 b.

Accordingly, static elimination executed by the ionizer 413 can preventthe semiconductor substrate 300 even in the load lock chamber 421 frombeing charged.

Thereafter, the gate valve 421 a of the load lock chamber 421 is closedto decompress the load lock chamber 421. Pressure of the load lockchamber 421 is equalized to that of the treatment chamber 423 inside thetreatment section 420 (first wafer treatment section).

After the load lock chamber 421 is decompressed, the gate valve 421 a ina side of the treatment chamber 423 is opened. A robot (not shown)provided in the treatment chamber 423 transports the semiconductorsubstrate 300 to the treatment chamber 423 (Step S4).

Then, in the treatment chamber 423, a desired process treatment (firsttreatment) is executed at the semiconductor substrate 300 (semiconductorsubstrate 300 of (D) shown in FIG. 5).

After the process treatment, the above-mentioned robot in the treatmentchamber 423 transports the semiconductor substrate 300 into thedecompressed unload lock chamber 422 (Step S5).

Similarly to the case of the load lock chamber 421, the semiconductorsubstrate 300 (semiconductor substrate 300 of (E) shown in FIG. 5) doesnot have a potential of 0 V in the unload lock chamber 42. Therefore,static elimination can executed by the ionizer 413 since the unload lockchamber 422 and the transport area 410 are linked to each other.

Thereafter, the gate valve 422 a of the unload lock chamber 422 isclosed to pressurize the unload lock chamber 422 up to normal pressure.After the pressurization, the gate valve 422 a in a side of thetransport area 410 is opened. The transport robot 411 in the transportarea 410 transports the process-treated semiconductor substrate 300 fromthe unload lock chamber 422 to the transport area 410 (Step S6).

Further, this semiconductor substrate 300 is transported into thecontainer 200 (container 200 located at a lower side in FIG. 5) on theload port 100 a. In this manner, the process-treated semiconductorsubstrates 300 are sequentially returned to the original container 200(Step S7).

The ionizer 413 in the transport area 410 can static-eliminate thesemiconductor substrate 300 in which process treatment has beenperformed by the robot hand 411 a during transportation, or thesemiconductor substrate 300 (the semiconductor substrate 300 of (A)shown in FIG. 5) which is accommodated in the container 200.

Namely, with the semiconductor substrate 300 grounded, the semiconductorsubstrate 300 is accommodated in the container 200.

After the process treatment is completed for all semiconductorsubstrates 300 accommodated in the container 200 shown in the lower sideof FIG. 5 and these semiconductor substrates are accommodated in theoriginal container 200, the opener opening/closing mechanism 130 shownin FIG. 1B closes the cover 220 of the container 200, and releases alinking state between the container 200 (firstsemiconductor-accommodating container) and the local cleaning chamber430.

This returns the container 200 to the sealed state.

This container 200 is transported to a predetermined location of thesemiconductor manufacturing apparatus 400 for the next step (Step S8).

The process treatment of the semiconductor substrates 300 in thetreatment section 420 of the semiconductor manufacturing apparatus 400is performed by a single wafer treatment.

Further, a transporting sequence of the semiconductor substrate 300 fromstep S1 to step S8 is a sequence for one semiconductor substrate 300predetermined. However, for example, while the above-mentioned onesemiconductor substrate 300 predetermined is process-treated in thetreatment section 420 (semiconductor substrate 300 of (D) shown in FIG.5), the other semiconductor substrates 300 before the process treatmentare subsequently waiting in the load lock chamber 421 (semiconductorsubstrate 300 of (C) shown in FIG. 5), the alignment section 415(semiconductor substrate 300 of (B) shown in FIG. 5), and the container200 (semiconductor substrate 300 of (A) shown in FIG. 5).

Next, modifications of the present embodiment 1 shown in FIGS. 7 and 8will be described below.

FIG. 7 shows a modification of the semiconductor manufacturing apparatus400, and the modification has such a structure that the transport area410 and the treatment section 420 are directly linked without linkingthe load lock chamber 421 or the unload lock chamber 422 therebetween.Even in this case, it is possible to static-eliminate the semiconductorsubstrate 300 (see FIG. 2) before and after the process treatment byinstalling the ionizer 413 in the transport area 410.

the semiconductor manufacturing apparatus 400 shown in FIG. 7 isprovided with a chemical filter 414 on the fan filter unit 412 of thetransport area 410. By this, chemical contamination of the semiconductorsubstrate 300 can be avoided.

FIG. 8 illustrates an operation of the opening/closing apparatus 100when a modified semiconductor-accommodating container 500 (hereafterreferred to as a container 500) is used.

That is, the container 500 is not a bottom opening/closing type but afront opening/closing type. This container comprises a container body510, a cover 520, and a substrate holding section 510 b. When this isset on the cover 520 of the opening/closing apparatus 100, the cover 520is set downward.

Therefore, when the opener opening/closing mechanism 130 of theopening/closing apparatus 100 shown in FIG. 1 opens or closes thecontainer 500, the opener rising/falling mechanism 131 makes an elevator131 a shown in FIG. 8 lower or raise, and makes the substrate holdingsection 510 b exposed from the container 500. Thereby, the semiconductorsubstrates 300 is carried in or out through the opening portion 510 a ofthe substrate holding section 510 b.

Accordingly, even the bottom opening/closing type container 500 can beapplied similarly to the front opening/closing type container 200.

According to the method of manufacturing the semiconductor integratedcircuit device that is the present embodiment 1, thesemiconductor-accommodating container may be a front opening/closingtype or a bottom opening/closing type in the case of a sealed type.

The method of manufacturing the semiconductor integrated circuit devicethat is the present embodiment 1 will have operations and effects asfollows.

That is, the ionizer 413 static-eliminates the semiconductor substrate300 process-treated by the treatment section 420 in the transport area410 between the load port 100 a of the semiconductor manufacturingapparatus 400 and the treatment section 420. Being accommodated in thecontainer 200 on the load port 100 a can eliminates electric chargesfrom the semiconductor substrate 300 charged.

Therefore, it is possible to decrease amounts of foreign materialsadhering to the semiconductor substrate 300 and to improve a yieldthereof.

Further, it is also possible to static-eliminate contact portions(regions) being in contact with the semiconductor substrate 300, forexample, the robot hand 411 a, the substrate supporting stands 421 b ofthe load lock chamber 421, or the like. Consequently, it is possible toeliminate potential difference between the semiconductor substrate 300and the semiconductor substrate contact portions.

Therefore, it is possible to reduce disadvantages of handling errorscaused by the semiconductor substrate 300 charged, and transportingerrors of semiconductor substrate 300, and the like.

As a result, it is possible to improve reliability for transporting thesemiconductor substrate 300 and an operating ratio of the semiconductormanufacturing apparatus 400.

Since electric charge can be eliminated from the semiconductor substrate300 charged, it is possible to decrease a damage to the semiconductorsubstrate 300 due to a discharge and consequently improve a yield of thesemiconductor substrate 300.

The following describes a speed for opening and closing the cover 220 ofthe container 200.

When the semiconductor substrate 300 (semiconductor wafer) istransported from the container 200 to the semiconductor manufacturingapparatus 400 or from the semiconductor manufacturing apparatus 400 tothe container 200, the semiconductor manufacturing apparatus 400 and thecontainer 200 are connected via the opening/closing apparatus 100.Therefore, by opening and closing the cover 220 of the container 200, aclean area inside the semiconductor manufacturing apparatus 400 and aclean area inside the container 200 are directly connected to eachother.

At this time, internal pressure of the semiconductor manufacturingapparatus 400 is slightly set to be positive pressure in comparison tothe outside world. Except for moments when the container 200 is openedand closed, there is a little possibility that foreign materials enter agap between a flange 211 of the container 200 and the surface plate 150of the opening/closing apparatus 100.

However, if the opener opening/closing mechanism 130 of theopening/closing apparatus 100 has high speed of the operation thereof,the inside of the container 200 becomes negative pressure at momentswhen the cover 220 is pulled out of the container body 210.Consequently, foreign materials enter the inside of the container 200through a gap between the flange 211 of the container 200 and thesurface plate 150 of the opening/closing apparatus 100 and adhering tothe semiconductor substrate 300.

The opening/closing speed of the cover 220 is disclosed in PCTapplication No. PCT/JP00/05012 (international filing date Jul. 27, 2000)by the inventors in detail.

Embodiment 2

FIG. 9 is a partial plan view showing an example of a step between aconnection surface of an opener and a surface of a surface plate in asubstrate accommodating container opening/closing apparatus used by amethod of manufacturing a semiconductor integrated circuit device thatis embodiment 2 of the present invention. FIG. 10 is a partially planview showing an example of amounts of overlap between a connectionsurface of an opener and an exposed surface of asemiconductor-accommodating container in a substrate accommodatingcontainer opening/closing apparatus that is the embodiment 2 of thepresent invention. FIG. 11 is a partial side view showing an example ofholding the opener of the semiconductor manufacturing apparatus shown inFIG. 10.

The method of manufacturing a semiconductor integrated circuit devicethat is the present embodiment 2 uses the container 200 shown in FIG. 2,that is a FOUP, which is a sealed type described in the embodiment 1 anda front-opening/closing type, and carries in or out the semiconductorsubstrate 300 having the diameter of 300 mm to or from the semiconductormanufacturing apparatus 400. At this time, said method explains apositional relation between the cover 220 of the container 200 and theconnection surface 120 a of the opener 120 for the opening/closingapparatus 100 installed in the semiconductor manufacturing apparatus400.

With respect to the container 200, a container length L shown in FIG. 9(the container length L is a length between a facial reference surface230 of the container 200 and an end portion of container body 210 in afront surface side of the container, or between a facial referencesurface 230 and an exposed surface 220 a of the cover 220) provides thatif the container length is (y33), y33=165.5±0.5 mm under the SEMIstandards E47.1 and E62. Namely, the container length L is set to beL=165.5 mm±0.5 mm.

Further, the same standards provides that a side of the load port 100 ais also set to be y33=165.5±0.5 mm.

About the step D between the connection surface 120 a of the opener 120for the opening/closing apparatus 100 and the surface 150 a of thesurface plate 150, the SEMI standard E62 provides that tolerance (y34)thereof is set to be y34=±0.25 mm.

In the present embodiment 2, the step D between the connection surface120 a of the opener 120 and the surface 150 a of the surface plate 150,that is, projecting amounts from the surface 150 a of the surface plate150 of the connection surface 120 a of the opener 120 is set to belonger than 0.25 mm. Namely, the connection surface 120 a of the opener120 is projected from the surface 150 a of the surface plate 150 over0.25 mm.

Moreover, the connection surface 120 a of the opener 120 is projectedfrom the surface 150 a of the surface plate 150 over 0.3 mm (namely, theabove-mentioned projecting amounts are set to be longer than 0.3 mm).

The above-mentioned projecting amounts depend on a virtual stop position(based on servo control, etc.) of the opener 120 in the case of no FOUP(container 200).

Optimally, the projecting amounts are 1.0 mm. An appropriate range is0.7 mm<projecting amounts. A preferable range is 0<projecting amounts<10mm.

By setting the projecting amounts to the optimum value of 1.0 mm, it ispossible to provide the opening/closing apparatus 100 which is reliablyopening/closing possible even if the container length L has the minimumvalue of 165 mm.

About projecting amounts from the surface 150 a of the surface plate 150of the connection surface 120 a of the opener 120, when the container200 is set on the load port 100 a, the opener 120 supported by an openersupporting portion 130 a cantilevered as shown in FIG. 11 retreatsinside the apparatus, by moving in parallel at a side of thesemiconductor manufacturing apparatus 400.

As shown in FIG. 11, the opener 120 is supported by the opener support130 a (cantilever beam). When the container 200 is positioned to theload port 100 a, the opener 120 supported by an opener supportingportion 130 a cantilevered as shown in FIG. 11 retreats inside theapparatus, by moving in parallel at a side of the semiconductormanufacturing apparatus 400. The projecting amounts may be preferablywithin a range capable of horizontally operating the opener 120.

In the method of manufacturing the semiconductor integrated circuitdevice that is the present embodiment 2, under the condition that suchthe step D (above-mentioned projecting amounts) is set, thesemiconductor substrate 300 is carried in or out.

First, the full state container 200 (first semiconductor-accommodatingcontainer) accommodating a plurality of semiconductor substrates 300therein is located on the stage 110 of the opening/closing apparatus 100shown in FIG. 1.

At this time, a front surface which is a first surface of the container200 is come in contact with or closely faced at the surface 150 a of thesurface plate 150 of the opening/closing apparatus 100 of the localcleaning chamber 430 such that the rotary keys 121 of the opener 120 areinserted into the key grooves 221 of the cover 220 of the container 200.

Thereafter, the connection surface 120 a of the opener 120 is put intocontact with the exposed surface 220 a of the cover 220 to hold (seize)the cover 220 by the opener 120.

At this time, the connection surface 120 a (front portion) of the opener120 is maintained so as to project over 0.25 mm from the surface 150 aof the surface plate 150 in the case where the container 200 is notprovided.

Consequently, since the connection surface 120 a of the opener 120projects from the surface 150 a of the surface plate 150, the connectionsurface 120 a of the opener 120 is closely and certainly contact withthe exposed surface 220 a of the cover 220 of the container 200.

Thereafter, the opener 120 vertically moves the cover 220 relative tothe opening surface of the container 200 to open the cover 220. Thisconnects the opening 210 a of the container 200 and the opening 150 b ofthe surface plate 150 for the opening/closing apparatus 100 to eachother.

Subsequently, the semiconductor substrate 300 is carried in or out fromthe container between the container 200 and the semiconductormanufacturing apparatus 400 via the opening 210 a of the container 200and the opening 150 b of the opening/closing apparatus 100.

An overlap amount T in FIG. 10 is set to 0<T≦1.25 mm in order to ensurea contact between the opener 120 and the cover 220 when the cover 220 ofthe container 200 is opened and closed.

The overlap amount T corresponds to an overlap between the containerlength L of the container 200 and the projection amount (Step D) fromthe surface 150 a of the surface plate 150 for the opener 120.

According to the above-mentioned SEMI standard, the container length Lis assumed to be y33 and is specified as y33=165.5±0.5 mm. On the sideof the load port 100 a, a distance P from the facial reference surface230 during docking to the surface 150 a of the surface plate 150 isassumed to be y33 and is specified as y33=165.5±0.5 mm. There is thestep D between the connection surface 120 a of the opener 120 for theopening/closing apparatus 100 and the surface 150 a of the surface plate150. This step's tolerance is assumed to be y34 and is specified asy34=±0.25 mm in the above-mentioned SEMI standard.

The maximum overlap amount T is a sum of maximum tolerances for thecontainer length L, the distance P, and the step D, and results inT=1.25 mm. The maximum overlap amount T is a sum of minimum tolerancesfor these values and results in T=−1.25 mm. This means generation of a1.25 mm gap between the opener 120 and the cover 220.

The method of manufacturing the semiconductor integrated circuit deviceaccording to embodiment 2 requires contact between the opener 120 andthe cover 220. The overlap amount T is at least T>0. An allowable rangeof the overlap amount T is 0<T≦1.25 mm.

Accordingly, the overlap amount T (mm) needs to be T>0 for allcontainers 200 operating on the semiconductor manufacturing line. Adesirable range is 0<T≦1.25 for all containers 200 operating on thesemiconductor manufacturing line.

Actually, it is difficult for all containers 200 operating on thesemiconductor manufacturing line to satisfy the condition of T>0.Accordingly, it is desirable to keep a percentage of incomplete contactbetween the connection surface 120 a of the opener 120 and the exposedsurface 220 a of the cover 220 to be 1% or less for all containers 200operating on the semiconductor manufacturing line.

However, a percentage of incomplete contact between the opener 120 andthe cover 220 may exceed 1% of all containers 200 operating on thesemiconductor manufacturing line.

The method of manufacturing the semiconductor integrated circuit deviceaccording to embodiment 2 provides the following advantageous effects.

Namely, the connection surface 120 a of the opener 120 is made toproject from the surface 150 a of the surface plate 150 for theopening/closing apparatus 100 installed on the semiconductormanufacturing apparatus 400. Thus, it is possible to ensure contactbetween the connection surface 120 a of the opener 120 and the cover 220of the container 200 when the cover 220 of the container 200 is openedand closed.

Accordingly, it is possible to decrease damages to the container 200,prevent dust generation, and extend an endurance period of the container200.

Since the connection surface 120 a of the opener 120 can contact withthe cover 220 of the container 200, it is possible to reliably open andclose the cover 220, preventing a foreign materials from adhering to thesemiconductor substrate 300.

The use of the ionizer 413 according to embodiment 1 can improve thereliability for carrying the semiconductor substrate 300 and opening andclosing the cover 220 of the container 200. Hence, it is possible toprevent a decrease in the operating ratio of the semiconductormanufacturing apparatus 400 on the entire semiconductor manufacturingline.

While there have been described the present invention by the inventorsbased on specific preferred embodiments 1 and 2, it is to be distinctlyunderstood that the present invention is not limited to embodiments 1and 2. It is further understood by those skilled in the art that variouschanges and modifications may be made in the present invention withoutdeparting from the spirit and scope thereof.

The semiconductor manufacturing apparatus 400 described in embodiments 1and 2 is not limited to pre-processes. The apparatus may be aninspection apparatus or a wafer sorter which does not directly conductmanufacture on the semiconductor substrate 300. Also in this case, it ispossible to provide same effects as for embodiments 1 and 2.

The following summarizes advantageous effects obtained by major aspectsof the present invention disclosed in the application concerned.

(1) A yield of semiconductor substrates can be improved.

(2) An operating ratio of-the semiconductor manufacturing apparatus canbe improved.

1. A method of manufacturing a semiconductor integrated circuit device,comprising the steps of: (a) connecting an internal space of a sealedtype wafer container, which accommodates a plurality of wafers groundedthrough the wafer container, to a local clean chamber of a first wafertreatment apparatus; (b) transporting the wafers in the wafer containerunder the connected state by means of a transport mechanism disposed inthe local clean chamber through the local clean chamber, therebytransporting the wafers into a wafer treatment section of the firstwafer treatment apparatus; (c) performing a first treatment to thewafers in the wafer treatment section; (d) after step (c), transportingtreated wafers by the transport mechanism from the wafer treatmentsection, thereby accommodating the treated wafers in the wafer containerthrough the local clean chamber; (e) eliminating static charge of thetreated wafers in step (d), wherein the eliminating static chargeeliminates static charge of treated wafers in the wafer containerconnected with the local clean chamber, and also eliminates staticcharge of wafers in a load lock and unload lock mechanism disposedbetween the wafer treatment section and the local clean chamber; and (f)undocking the wafer container from the local clean chamber after thestep (d), and returning the wafer container to a sealed state.
 2. Themethod of manufacturing a semiconductor integrated circuit deviceaccording to claim 1, wherein each of the wafers has a diameter of 280mm or more.
 3. The method of manufacturing a semiconductor integratedcircuit device according to claim 1, wherein a wafer contact portion ofthe wafer container has a surface resistivity R of 1×10⁴<R (ohm)<1×10¹⁴.4. The method of manufacturing a semiconductor integrated circuit deviceaccording to claim 1, wherein a wafer contact portion of the wafercontainer has a surface resistivity R of 1×10⁵<R (ohm)<1×10¹³.
 5. Themethod of manufacturing a semiconductor integrated circuit deviceaccording to claim 1, wherein a wafer contact portion of the wafercontainer has a surface resistivity R of 1×10⁶<R (ohm)<1×10⁹.
 6. Themethod of manufacturing a semiconductor integrated circuit deviceaccording to claim 1, wherein the static charge elimination is performedby an ionizer.
 7. The method of manufacturing a semiconductor integratedcircuit device according to claim 6, wherein a wafer contact portion ofthe transport mechanism is static-charge-eliminated at substantially thesame time as the static elimination of the treated wafers.
 8. The methodof manufacturing a semiconductor integrated circuit device according toclaim 7, wherein the ionizer is disposed in the local clean chamber. 9.The method of manufacturing a semiconductor integrated circuit deviceaccording to claim 6, wherein the ionizer is disposed in the local cleanchamber.
 10. The method of manufacturing a semiconductor integratedcircuit device according to claim 1, wherein a wafer contact portion ofthe transport mechanism is nonconductive.
 11. The method ofmanufacturing a semiconductor integrated circuit device according toclaim 10, wherein the wafer contact portion of the transport mechanismis of a nonconductive resin.
 12. The method of manufacturing asemiconductor integrated circuit device according to claim 1, whereinthe eliminating static charge eliminates static charge on treated waferswhen passing through the local clean chamber.
 13. The method ofmanufacturing a semiconductor integrated circuit device according toclaim 9, wherein a fan filter is disposed at a ceiling of the localclean chamber.
 14. The method of manufacturing a semiconductorintegrated circuit device according to claim 13, wherein the ionizer isdisposed between the transport mechanism and the fan filter.
 15. Themethod of manufacturing a semiconductor integrated circuit deviceaccording to claim 14, wherein the eliminating static charge eliminatesstatic charge on treated wafers when passing through the local cleanchamber.
 16. The method of manufacturing a semiconductor integratedcircuit device according to claim 15, wherein a wafer contact portion ofthe transport mechanism is nonconductive.
 17. The method ofmanufacturing a semiconductor integrated circuit device according toclaim 14, wherein each of the wafers has a diameter of 280 mm or more.18. The method of manufacturing a semiconductor integrated circuitdevice according to claim 15, wherein each of the wafers has a diameterof 280 mm or more.